Qualcomm, TDK Forming $3 Billion Joint Venture
Qualcomm and TDK are in a $3 billion deal for a joint venture for delivery of RF front-end (RFFE) modules and RF filters into integrated systems for mobile and IoT devices, drones, robotics and automotive applications. Called RF360 Holdings Singapore,…
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the venture will draw on TDK’s capabilities in micro-acoustic RF filtering, packaging and module integration and Qualcomm’s wireless technologies expertise, the companies said. Growing demands in mobile communications require current and future smartphones to support dozens of bands for 2G, 3G, 4G LTE and 5G, along with connectivity for wireless LAN, satellite navigation and Bluetooth. RF360 Holdings will initially be owned 51 percent by Qualcomm Global Trading and 49 percent by TDK subsidiary Epcos, the companies said. Filter and module design and manufacturing assets, plus related patents, will be carved out from TDK and its subsidiaries and be largely acquired by RF360, with certain assets being acquired directly by Qualcomm affiliates, they said of the deal seen closing by early next year.